ENGRMAE 227 Thermal Resistance Analysis in Microdevices and Nanomaterials (2017-2018)

ENGRMAE 227 Thermal Resistance Analysis in Microdevices and Nanomaterials

(Not required for any major.)
Catalog Data:

ENGRMAE 227 Thermal Resistance Analysis in Microdevices and Nanomaterials (Credit Units: 4) Heat transfer and thermal resistance analysis for microdevices and nanomaterials. Overview of recent progress in nanotechnology and materials science. Thermal modeling strategies for novel electronic devices and energy conversion systems. Graduate students only. (Design units: 0)

Required Textbook:
None
Recommended Textbook:
. Edition, , 1969, ISBN-13 978-0470501979.

References:

Nanoscale Energy Transport and Conversion, Chen, Oxford, 2005 Introduction to Solid State Physics, Kittel, Wiley 1986 Solid State Physics, Ashcroft and Mermin, Brooks Cole, 1976

Coordinator:
Jaeho Lee
Relationship to Student Outcomes
No student outcomes specified.
Course Learning Outcomes. Students will:
Prerequisites by Topic

ENGRMAE 120 Heat and Mass Transfer or equivalent

Lecture Topics:
  • Overview of Nanotechnology and Materials Science
  • Fundamentals of Heat Transfer
  • Thermal Conduction Modeling
  • Thermal Convection Modeling
  • Thermal Radiation Modeling
  • Fundamentals of Solid State Physics
  • Thermal Transport Modeling for Nanomaterials
  • Thermal Management of Semiconductor Devices
  • Thermoelectric Energy Conversion Technologies
  • Micro- and Nanoscale Thermometry
  • Thermal Characterization Methods for Nanomaterials
Class Schedule:

Meets for 3 hours of lecture each week for 10 weeks.

Computer Usage:
Laboratory Projects:
Professional Component
Design Content Description
Approach:
Lectures:
Laboratory Portion:
Grading Criteria:

Homework sets: 30% Midterm exam: 30% Final presentation: 20% Final report: 20% Total: 100%

Estimated ABET Category Content:

Mathematics and Basic Science: 0.0 credit units

Computing: 0.0 credit units

Engineering Topics: 4.0 credit units

Engineering Science: 4.0 credit units

Engineering Design: 0.0 credit units

Prepared:
January 23, 2017
Senate Approved:
December 20, 2016
Approved Effective:
2017 Fall Qtr