EECS 273 Electronics Packaging (2017-2018)

EECS 273 Electronics Packaging

(Not required for any major.)
Catalog Data:

EECS 273 Electronics Packaging (Credit Units: 4) Materials, processes, techniques, and principles in interconnect and packaging of electronic products after the device-containing semiconductor wafer is fabricated. The electronic, optical, thermal, mechanical, and reliability properties of the materials are evaluated in the context of modern electronics manufacturing processes. Graduate students only. (Design units: 0)

Required Textbook:
. Edition, , 1969, ISBN-13 978-0471466093.

Recommended Textbook:
Relationship to Student Outcomes
No student outcomes specified.
Course Learning Outcomes. Students will:
Prerequisites by Topic
Lecture Topics:


Class Schedule:

Meets for 3 hours of lecture each week for 10 weeks.

Computer Usage:
Laboratory Projects:
Professional Component
Design Content Description
Laboratory Portion:
Grading Criteria:
Estimated ABET Category Content:

Mathematics and Basic Science: 0.0 credit units

Computing: 0.0 credit units

Engineering Topics: 0.0 credit units

Engineering Science: 0.0 credit units

Engineering Design: 0.0 credit units

February 22, 2017
Senate Approved:
April 26, 2013
Approved Effective:
2013 Fall Qtr