EECS 273 Electronics Packaging (2012-2013)

EECS 273 Electronics Packaging

(Not required for any major.)
Catalog Data:

EECS 273 Electronics Packaging (Credit Units: 4) Materials, processes, techniques, and principles in interconnect and packaging of electronics products after the device-containing semiconductor wafer is fabricated. The electronic, optical, thermal, mechanical, and reliability properties of the materials are evaluated in the context of modern electronics manufacturing processes. Graduate students only. (Design units: 0)

Required Textbook:
. Edition, , 1969, ISBN-13 978-0471466093.

Recommended Textbook:
None
References:
None
Coordinator:
Relationship to Student Outcomes
No student outcomes specified.
Course Learning Outcomes. Students will:
Prerequisites by Topic
Lecture Topics:

None.

Class Schedule:

Meets for 3 hours of lecture each week for 10 weeks.

Computer Usage:
Laboratory Projects:
Professional Component
Design Content Description
Approach:
Lectures:
Laboratory Portion:
Grading Criteria:
Estimated ABET Category Content:

Mathematics and Basic Science: 0.0 credit units

Computing: 0.0 credit units

Engineering Topics: 0.0 credit units

Engineering Science: 0.0 credit units

Engineering Design: 0.0 credit units

Prepared:
April 18, 2012
Senate Approved:
February 2, 2012
Approved Effective:
2012 Fall Qtr