CBEMS 174 Semiconductor Device Packaging (2015-2016)

CBEMS 174 Semiconductor Device Packaging

(Not required for any major. Selected Elective for ChE and MSE.)
Catalog Data:

CBEMS 174 Semiconductor Device Packaging (Credit Units: 3) Introduction to the semiconductor device packaging and assembly process. Electrical, thermal, optical, and mechanical aspects of package design and reliability. Special topics on optoelectronics packaging will be covered. Prerequisite: CBEMS45B. Chemical Engineering and Materials Science Engineering majors have first consideration for enrollment. (Design units: 1)

Required Textbook:
None
Recommended Textbook:
. Edition, , 1969, ISBN-13 978-0201444940.

References:
  • Brown et al. Advanced Electronic Packaging, IEEE Press, 2005.
  • Tummala et al. Fundamentals of Microsystem Packaging, McGraw Hill, 2001.
  • Advanced Packaging Magazine (http://www.apmag.com)
  • Chip Scale Review (http://www.chipscalereview.com)
  • IEEE Transactions on Advanced Packaging
  • IEEE Transactions on Components and Packaging Technologies
Coordinator:
Frank G. Shi
Relationship to Student Outcomes
No student outcomes specified.
Course Learning Outcomes. Students will:

1. Understand microelectronics and photonics components manufacturing process.

2. Understand professional and ethical responsibility.

3. Understand the impact of engineering solution in a global and societal context.

4. Recognize the need for life-long learning.

Prerequisites by Topic

Engineering calculations, differential equations; Materials and semiconductor physics; Momentum, heat and mass transfer; Reaction engineering and reactor design; Computer literacy and basic skills (Fortran, Matlab, C++, Basic, etc.)

Lecture Topics:
  • Silicon Materials
  • Thermal Oxidation of Silicon
  • Photolithography,
  • Diffusion, Ion Implantation
  • Thin Film Deposition
  • Cu Interconnect Technology
  • Chemical-Mechanical Planarization for Microelectronics
  • Manufacturing
  • IC Packaging
  • Optical-Fiber Communication
  • Fundamentals of Optical fibers
  • Signal Degradation in Optical Fibers
  • Photonic Packaging and Automation
Class Schedule:

Meets for 3 hours of lecture each week for 10 weeks.

Computer Usage:

Needed for analyzing and designing fabrication processes and for analyzing laser-optic coupling.

Laboratory Projects:

None.

Professional Component

This course is designed to contribute towards the Materials Science Engineering major through the engineering topics and design experience.

Design Content Description
Approach:

Lectures and project(s) Most of lectures are on analysis and design of microelectronics fabrication processes, and fiber-optic communication processes

Lectures: 100%
Laboratory Portion: 0%
Grading Criteria:
  • Homework: 20%
  • Class Participation/Discussion: 15%
  • Exam #1: 20%
  • Exam #2: 25%
  • Term Paper: 20%
  • Total: 100%
Estimated ABET Category Content:

Mathematics and Basic Science: 0.0 credit units

Computing: 0.0 credit units

Engineering Topics: 3.0 credit units

Engineering Science: 2.0 credit units

Engineering Design: 1.0 credit units

Prepared:
August 6, 2014
Senate Approved:
April 5, 2013
Approved Effective:
2013 Fall Qtr