CBEMS 174 Semiconductor Device Packaging (2013-2014)

CBEMS 174 Semiconductor Device Packaging

(Not required for any major. Selected Elective for ChE and MSE.)
Catalog Data:

CBEMS 174 Semiconductor Device Packaging (Credit Units: 3) Introduction to the semiconductor device packaging and assembly process. Electrical, thermal, optical, and mechanical aspects of package design and reliability. Special topics on optoelectronics packaging will be covered. Prerequisite: CBEMS45B. Chemical Engineering and Materials Science Engineering majors have first consideration for enrollment. (Design units: 1)

Required Textbook:
Recommended Textbook:
. Edition, , 1969, ISBN-13 978-0201444940.

  • Brown et al. Advanced Electronic Packaging, IEEE Press, 2005.
  • Tummala et al. Fundamentals of Microsystem Packaging, McGraw Hill, 2001.
  • Advanced Packaging Magazine (http://www.apmag.com)
  • Chip Scale Review (http://www.chipscalereview.com)
  • IEEE Transactions on Advanced Packaging
  • IEEE Transactions on Components and Packaging Technologies
Frank G. Shi
Relationship to Student Outcomes
No student outcomes specified.
Course Learning Outcomes. Students will:

1. Understand microelectronics and photonics components manufacturing process.

2. Understand professional and ethical responsibility.

3. Understand the impact of engineering solution in a global and societal context.

4. Recognize the need for life-long learning.

Prerequisites by Topic

Engineering calculations, differential equations; Materials and semiconductor physics; Momentum, heat and mass transfer; Reaction engineering and reactor design; Computer literacy and basic skills (Fortran, Matlab, C++, Basic, etc.)

Lecture Topics:
  • Silicon Materials
  • Thermal Oxidation of Silicon
  • Photolithography,
  • Diffusion, Ion Implantation
  • Thin Film Deposition
  • Cu Interconnect Technology
  • Chemical-Mechanical Planarization for Microelectronics
  • Manufacturing
  • IC Packaging
  • Optical-Fiber Communication
  • Fundamentals of Optical fibers
  • Signal Degradation in Optical Fibers
  • Photonic Packaging and Automation
Class Schedule:

Meets for 3 hours of lecture each week for 10 weeks.

Computer Usage:

Needed for analyzing and designing fabrication processes and for analyzing laser-optic coupling.

Laboratory Projects:


Professional Component

This course is designed to contribute towards the Materials Science Engineering major through the engineering topics and design experience.

Design Content Description

Lectures and project(s) Most of lectures are on analysis and design of microelectronics fabrication processes, and fiber-optic communication processes

Lectures: 100%
Laboratory Portion: 0%
Grading Criteria:
  • Homework: 20%
  • Class Participation/Discussion: 15%
  • Exam #1: 20%
  • Exam #2: 25%
  • Term Paper: 20%
  • Total: 100%
Estimated ABET Category Content:

Mathematics and Basic Science: 0.0 credit units

Computing: 0.0 credit units

Engineering Topics: 3.0 credit units

Engineering Science: 2.0 credit units

Engineering Design: 1.0 credit units

April 11, 2013
Senate Approved:
April 5, 2013
Approved Effective:
2013 Fall Qtr